Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5362500
Kind Code:
B2
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Inventors:
Atsushi Suzuki
Hideki Kitada
Hideki Kitada
Application Number:
JP2009216768A
Publication Date:
December 11, 2013
Filing Date:
September 18, 2009
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/3205; C25D5/10; C25D7/12; H01L21/28; H01L21/288; H01L21/768; H01L23/532
Domestic Patent References:
| JP200533050A | ||||
| JP2005166917A | ||||
| JP2003257979A | ||||
| JP2000252357A | ||||
| JP2006294922A |
Attorney, Agent or Firm:
Takeshi Hattori