Title:
耐チッピング性付与水性分散体組成物
Document Type and Number:
Japanese Patent JP5374488
Kind Code:
B2
Abstract:
Disclosed is a chipping resistance-imparting aqueous dispersion composition comprising a nonvolatile component (film-forming component) dispersed in water, said nonvolatile component containing an olefin thermoplastic elastomer or a styrene/conjugated diene block copolymer or its hydrogenation product. A coating film obtained by the use of the aqueous dispersion composition as an aqueous primer or an additive to a water paint is excellent in chipping resistance as well as in other properties such as film appearance, adhesion properties, heat resistance, moisture resistance and gasoline resistance.
Inventors:
Arikawa Hideo
Taku Tokita
Taku Tokita
Application Number:
JP2010287613A
Publication Date:
December 25, 2013
Filing Date:
December 24, 2010
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08J3/05; C08F255/02; C08L35/00; C08L51/06; C08L53/02; C09D5/00; C09D5/02; C09D151/06; C09D153/02
Domestic Patent References:
| JP11029673A | ||||
| JP8505426A |
Attorney, Agent or Firm:
Patent corporation ssinpat