Title:
パワーモジュール
Document Type and Number:
Japanese Patent JP5381444
Kind Code:
B2
Abstract:
To provide a power module miniaturized and having improved reliability of a connection part.
In the power module 1 in which a power element 10 and a control element 11 for controlling the drive of the power element 10 are configured as modules, a signal part 10e of the power element 10 and a signal part of the control element 11 are flip-chip connected and laminated to each other. Further, lead frames 12a, 12b are respectively formed on both the surfaces of the power element 10 and one lead frame 12b is shared by the power element 10 and the control element 11. The power element 10, the control element 11 and the lead frames 12 are mold-sealed with resin 17.
COPYRIGHT: (C)2011,JPO&INPIT
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Inventors:
Takuya Gate
Application Number:
JP2009168979A
Publication Date:
January 08, 2014
Filing Date:
July 17, 2009
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L25/18; H01L23/48; H01L25/065; H01L25/07
Domestic Patent References:
| JP2005510878A | ||||
| JP2001168271A | ||||
| JP2004303854A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Hikaru Suzuki
Yoshiki Kuroki
Hikaru Suzuki
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