Title:
互い違いになっている積層されたセグメントを有する集積キャパシタ
Document Type and Number:
Japanese Patent JP5385989
Kind Code:
B2
Abstract:
A capacitor in an integrated circuit (“IC”) has a first node plate link formed in a first metal layer of the IC electrically connected to and forming a portion of a first node of the capacitor extending along a first axis (y) and a second node plate link formed in a second metal layer of the IC extending along the axis and connected to the first node plate with a via. A third node plate link formed in the first metal layer is electrically connected to and forming a portion of a second node of the capacitor and extends along a second axis (x) of the node plate array transverse to the first node plate link, proximate to an end of the first node plate link and overlying a portion of the second node plate link.
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Inventors:
De Yong, Yang El
Stephen, Buyer
Stephen, Buyer
Application Number:
JP2011537484A
Publication Date:
January 08, 2014
Filing Date:
October 23, 2009
Export Citation:
Assignee:
XILINX INCORPORATED
International Classes:
H01L21/822; H01L21/82; H01L27/04
Domestic Patent References:
| JP2008112974A | ||||
| JP2002033456A | ||||
| JP2006173418A | ||||
| JP2007505577A |
Foreign References:
| US20050135042 |
Attorney, Agent or Firm:
Fukami patent office