Title:
基板処理装置、基板処理方法、及び、半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5386973
Kind Code:
B2
Inventors:
Isao Sugaya
Shingo Matsuoka
Kazuya Okamoto
Shingo Matsuoka
Kazuya Okamoto
Application Number:
JP2008328606A
Publication Date:
January 15, 2014
Filing Date:
December 24, 2008
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
H01L21/02; H01L21/66
Domestic Patent References:
| JP2006278698A | ||||
| JP5006930A | ||||
| JP2000003841A | ||||
| JP2002343992A | ||||
| JP2009541981A |
Attorney, Agent or Firm:
Akihiro Ryuka
Kazutoshi Iiyama
Akashi Hideya
Shigenori Hayashi
Kazutoshi Iiyama
Akashi Hideya
Shigenori Hayashi