Title:
薄板ガラス基板のスクライブ方法
Document Type and Number:
Japanese Patent JP5416386
Kind Code:
B2
Inventors:
Koji Yamamoto
Su Ukou
Su Ukou
Application Number:
JP2008274768A
Publication Date:
February 12, 2014
Filing Date:
October 24, 2008
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/09; B23K26/00; B23K26/08; B23K26/364
Domestic Patent References:
| JP2008183599A | ||||
| JP2006027795A | ||||
| JP2007275920A | ||||
| JP2007090860A |
Attorney, Agent or Firm:
Yoshio Kashima