Title:
ダイシングテープ一体型ウエハ裏面保護フィルム
Document Type and Number:
Japanese Patent JP5456440
Kind Code:
B2
Abstract:
The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
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Inventors:
Takamoto Naohide
Ken Matsumura
Ken Matsumura
Application Number:
JP2009251125A
Publication Date:
March 26, 2014
Filing Date:
October 30, 2009
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/683; B32B7/10; C09J7/02; C09J201/00; H01L21/301; H01L21/60; H01L23/00
Domestic Patent References:
| JP2006140348A | ||||
| JP2008202046A | ||||
| JP2008248129A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office