To provide an adhesive sheet for processing a semiconductor, which hardly forms wrinkles when attached to an adherend, and a tape for processing a semiconductor.

The tape for processing the semiconductor 1 is equipped with: a long release sheet 2; a plurality of adhesive sheets 3 arranged in parallel to each other at the center in the width direction of a release surface of the release sheet 2; and auxiliary sheets 4 disposed on both ends in the width direction of the release surface of the release sheet 2. Each adhesive sheet 3 is equipped with: straight lateral sides 31 which are adjacent to both ends in the width direction of the tape for processing a semiconductor 1 and are arranged in parallel to each other; straight intermediate sides 32 extending obliquely in obtuse angles from edges of the lateral sides 31 toward inward of the tape for processing a semiconductor 1; and anterior end side 33 and posterior end side 34 each connecting two intermediate sides 32. The anterior end side 33 has a convex shape in unwinding direction of the adhesive sheet 3, provided that the convex has no concave portion.

COPYRIGHT: (C)2010,JPO&INPIT