Title:
キャリア付き銅箔
Document Type and Number:
Japanese Patent JP5481577
Kind Code:
B1
Abstract:
Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper layer layered onto the release layer; wherein the very thin copper layer has been roughened and the Rz of the very thin copper layer surface is 1.6 μm or less as measured with a non-contact roughness meter.
Inventors:
Tomoki Kobiki
Yuta Nagaura
Kazuhiko Sakaguchi
Toru Chiba
Yuta Nagaura
Kazuhiko Sakaguchi
Toru Chiba
Application Number:
JP2013012468A
Publication Date:
April 23, 2014
Filing Date:
January 25, 2013
Export Citation:
Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
C25D7/06; C25D1/04; H05K1/09; C25D3/38
Domestic Patent References:
| JP2011009267A | 2011-01-13 | |||
| JP2005290519A | 2005-10-20 | |||
| JP2011116074A | 2011-06-16 | |||
| JP2011074458A | 2011-04-14 | |||
| JP2007314855A | 2007-12-06 | |||
| JP2005161840A | 2005-06-23 | |||
| JP2005008955A | 2005-01-13 | |||
| JP2002134858A | 2002-05-10 | |||
| JP2007314855A | 2007-12-06 | |||
| JP2010236072A | 2010-10-21 | |||
| JP2012169598A | 2012-09-06 | |||
| JP2008285751A | 2008-11-27 | |||
| JP2011009267A | 2011-01-13 |
Foreign References:
| WO2012046804A1 | 2012-04-12 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation