Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
汚物処理装置
Document Type and Number:
Japanese Patent JP5486338
Kind Code:
B2
Abstract:
A waste disposal apparatus 11 includes an open/close sealing mechanism 28 that nips a film 15 at a position between a film accommodating portion 14 and a waste accommodating main body 13 to seal a space below the nipped part of the film 15 from a space above the nipped part of the film 15. The sealing mechanism 28 has a sealing door 33 capable of being opened and closed, and a sealing door receiving portion 35. Film nipping portions of the sealing door 33 and the sealing door receiving portion 35 include concavo-convex shapes that bend a vertical intermediate portion of a film portion to be nipped, laterally with respect to an imaginary straight line that connects upper and lower ends of the film portion to be nipped.

Inventors:
Ichiro Onishi
Hiroshi Nakayama
Application Number:
JP2010033890A
Publication Date:
May 07, 2014
Filing Date:
February 18, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Applica Children's Products Co., Ltd.
International Classes:
B65F1/06
Domestic Patent References:
JP2009520658A
JP2001002203A
JP7133003A
JP8026403A
JP2004528253A
Foreign References:
EP0356051A1
Attorney, Agent or Firm:
Patent Business Corporation Imy International Patent Office
Hidehiko Ito
Morishita Hachiro
Hiroyuki Yoshida



 
Previous Patent: コンバイン

Next Patent: ELECTRIC CHARGING METHOD AND DEVICE