Title:
半導体集積回路装置、及び、クロックデータ復元方法
Document Type and Number:
Japanese Patent JP5492951
Kind Code:
B2
Inventors:
Seiichi Umai
Takeshi Isesaki
Takeshi Isesaki
Application Number:
JP2012172504A
Publication Date:
May 14, 2014
Filing Date:
August 03, 2012
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H03L7/06; H03K5/00; H03L7/08; H04L7/02
Domestic Patent References:
| JP2007060652A | ||||
| JP2005064739A | ||||
| JP2006339858A | ||||
| JP2005257376A |
Foreign References:
| US7020227 |
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Yuji Toda