Title:
実装装置および実装方法
Document Type and Number:
Japanese Patent JP5501696
Kind Code:
B2
Abstract:
A mounting apparatus which mounts on a substrate, a component having an inclined surface which intersects with a contact surface of the substrate and the component, at an acute angle, includes a first light source having an optical path orthogonal to the contact surface, and a camera which picks up an image of the component and an image of the substrate, a second light source which irradiates light on the inclined surface, and a moving means which moves at least one of the component and the substrate relatively, in a plane parallel to the surface of contact, and reflected light which is irradiated from the second light source, and reflected by the inclined surface is incident on the image pickup section.
Inventors:
Hiroyuki Motohara
Application Number:
JP2009190275A
Publication Date:
May 28, 2014
Filing Date:
August 19, 2009
Export Citation:
Assignee:
Olympus Endo Technology America Inc.
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| JP2004087941A | ||||
| JP2006040978A | ||||
| JP2003168899A | ||||
| JP2007201038A |
Attorney, Agent or Firm:
Keisuke Saito
Iwao Hirayama
Iwao Hirayama