Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5519118
Kind Code:
B2
Inventors:
Takehide Shirato
Application Number:
JP2008108570A
Publication Date:
June 11, 2014
Filing Date:
April 18, 2008
Export Citation:
Assignee:
Takehide Shirato
International Classes:
H01L29/786; H01L21/02; H01L21/336; H01L21/76; H01L21/762; H01L27/12; H01L29/78
Domestic Patent References:
| JP2004319808A | ||||
| JP2007250652A | ||||
| JP2002299636A | ||||
| JP2007258463A | ||||
| JP2006041513A |
Foreign References:
| WO2006135336A1 |