半導体用放熱部品を基体とするパッケージ

Title:

半導体用放熱部品を基体とするパッケージ

Document Type and Number:

Japanese Patent JP5531329

Kind Code:

B2

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Inventors:

Hoshiaki Terao
Hiroki Ota
Hideaki Kohiki
Takashi Sawai
Tetsuro Takada

Application Number:

JP2009140858A

Publication Date:

June 25, 2014

Filing Date:

June 12, 2009

Export Citation:

Assignee:

jfe precision corporation
jfe Steel Corporation
Kyocera Corporation

International Classes:

H01L23/373; H01L23/06

Domestic Patent References:

Attorney, Agent or Firm:

Eiichi Kobayashi

Previous Patent: JPS5531328

Next Patent: JPS5531330