Title:
回路部材接続用接着剤及び半導体装置
Document Type and Number:
Japanese Patent JP5557526
Kind Code:
B2
Abstract:
Disclosed is a thermosetting adhesive for circuit member connection, which is composed of a resin composition containing a thermally crosslinkable resin and a curing agent reactive with the thermally crosslinkable resin and complex oxide particles dispersed in the resin composition.
Inventors:
Akira Nagai
Application Number:
JP2009522658A
Publication Date:
July 23, 2014
Filing Date:
July 09, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/60; C09J11/04; C09J163/00; C09J201/00; H05K1/14; H05K3/32
Domestic Patent References:
| JP2004269626A | 2004-09-30 | |||
| JPH0741544A | 1995-02-10 | |||
| JP2007031555A | 2007-02-08 |
Foreign References:
| WO2006132165A1 | 2006-12-14 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Kido 博兒
Ikeda Masato
Yoshinori Shimizu
Junichiro Sakamaki
Kido 博兒
Ikeda Masato