Title:
半導体装置
Document Type and Number:
Japanese Patent JP5559932
Kind Code:
B2
Inventors:
Seki Seiji
Application Number:
JP2013508806A
Publication Date:
July 23, 2014
Filing Date:
March 21, 2012
Export Citation:
Assignee:
ルネサス electronics incorporated company
International Classes:
G06F12/00; G06F12/06
Domestic Patent References:
| JP2003131943A | 2003-05-09 | |||
| JP2001043180A | 2001-02-16 | |||
| JP2001256109A | 2001-09-21 | |||
| JP2000194581A | 2000-07-14 | |||
| JPH06236353A | 1994-08-23 |
Attorney, Agent or Firm:
Patent business corporation Fukami patent firm