Title:
金属CMPスラリー組成物及びこれを用いる研磨方法
Document Type and Number:
Japanese Patent JP5563465
Kind Code:
B2
Abstract:
Provided is a slurry composition for chemical mechanical polishing (CMP) of a metal. The slurry composition comprises a copolymer whose average molecular weight is from about 600,000 to about 1,300,000 and whose monomers are acrylic acid and acrylamide in a molar ratio of about 1:30 to about 30:1. The slurry composition exhibits a non-Prestonian behavior to achieve minimized dishing and attain a high degree of planarization.
Inventors:
Butterfly homer
Kim Won Re
Know, John, Ile
Lee, Incun
Lee Taeyeon
Kim Won Re
Know, John, Ile
Lee, Incun
Lee Taeyeon
Application Number:
JP2010528781A
Publication Date:
July 30, 2014
Filing Date:
January 21, 2008
Export Citation:
Assignee:
Cheil Industries Inc.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2007019531A | ||||
| JP2006326760A | ||||
| JP2004532521A | ||||
| JP2004533115A | ||||
| JP2004204118A |
Foreign References:
| WO2006112377A1 |
Attorney, Agent or Firm:
Hatta International Patent Corporation