Title:
統合電気接点を有する基板把持搬送組立体、電気接点を付与する方法、及び、基板ハンドリング組立体
Document Type and Number:
Japanese Patent JP5567475
Kind Code:
B2
Abstract:
A substrate holding and transporting assembly is disclosed. The substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation, the spaced apart orientation of the pair of clamps enable support of a substrate with at least two independent points. The substrate holding and transporting assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.
Inventors:
Ouch Salz Alexander
Knop Robert
Lovekin Mike
Woods Karl A.
Knop Robert
Lovekin Mike
Woods Karl A.
Application Number:
JP2010509357A
Publication Date:
August 06, 2014
Filing Date:
May 16, 2008
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/677; B65G49/07; C25D7/12; C25D17/08; C25D17/10
Domestic Patent References:
JP2005328039A | ||||
JP2000031145A | ||||
JP5232421A | ||||
JP2001303295A | ||||
JP10145030A | ||||
JP2007138195A | ||||
JP2006152349A | ||||
JP2006117979A | ||||
JP4013662U | ||||
JP63119678U |
Attorney, Agent or Firm:
Meisei International Patent Office