Title:
半導体装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5589462
Kind Code:
B2
Inventors:
Hiroyasu Sadabetto
Application Number:
JP2010058586A
Publication Date:
September 17, 2014
Filing Date:
March 16, 2010
Export Citation:
Assignee:
Casio Computer Co., Ltd.
International Classes:
H01L25/00
Attorney, Agent or Firm:
Patent business corporation Mitsuaki international patent firm
Hiroshi Arafune
Yoshio Arafune
Hiroshi Arafune
Yoshio Arafune
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