Title:
積層体
Document Type and Number:
Japanese Patent JP5602805
Kind Code:
B2
Abstract:
Means for solving the problems The resin composition (X8) of the present invention comprises a thermoplastic resin composition containing
0 to 90 wt% of a propylene-based polymer (A8) whose melting point is 100°C or higher as measured with a differential scanning calorimeter, and
10 to 100 wt% of a soft propylene-based copolymer (B8) that is a copolymer of propylene and at least one C 2 -C 20 ±-olefin other than propylene, the Shore A hardness of (B8) being 30 to 80, the melting point of (B8) being lower than 100°C or not observed when measured with a differential scanning calorimeter;
relative to 100 parts by weight of the thermoplastic resin composition, that is, the total of (A8) and (B8),
0.1 to 10 parts by weight of a coupling agent (Y8); and
0 to 5 parts by weight of an organic peroxide (Z8).
Inventors:
Hoya 裕
Noda 公憲
Norihide Inoue
Kan Uehara
Eiji Shiba
Yamaguchi 昌賢
Kawamoto Study
Yamashita 明
Noda 公憲
Norihide Inoue
Kan Uehara
Eiji Shiba
Yamaguchi 昌賢
Kawamoto Study
Yamashita 明
Application Number:
JP2012180937A
Publication Date:
October 08, 2014
Filing Date:
August 17, 2012
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
B32B27/32; C08K5/14; C08K5/54; C08L23/10
Attorney, Agent or Firm:
Patent business corporation SSINPAT