To provide a photosensitive resin composition excellent in weather resistance, light resistance and heat resistance and allowing formation of a micropattern.
The photosensitive resin composition contains, as essential components: (i) an alkali-soluble resin expressed by general formula (1), having a carboxylic acid residue and a polymerizable unsaturated group in each molecule; (ii) a photopolymerizable monomer having at least one ethylenically unsaturated bond; and (iii) a photopolymerization initiator. In formula (1), X represents a bivalent substituent group that may contain a heteroatom inside; Y represents a substituent wherein a group containing a polymerizable double bond and a carboxyl group is bonded to an isocyanuric ring skeleton; and Z represents a hydrogen atom or a substituent group wherein a group containing a polymerizable double bond and a carboxyl group is bonded to an isocyanuric ring skeleton.
COPYRIGHT: (C)2011,JPO&INPIT
Masaomi Takano
Shuichiro Nagatani
Aoyama 健
Katsuo Naruse
Tomohiro Nakamura
Sano Eiichi