Title:
多層配線基板、部品内蔵基板、および多層配線基板の製造方法
Document Type and Number:
Japanese Patent JP5607573
Kind Code:
B2
Inventors:
Iwamoto Hanyu
Wood Yoshitaka
Norito Tsukahara
Wood Yoshitaka
Norito Tsukahara
Application Number:
JP2011100310A
Publication Date:
October 15, 2014
Filing Date:
April 28, 2011
Export Citation:
Assignee:
Panasonic incorporated company
International Classes:
H05K3/46; H05K1/11; H05K3/40
Attorney, Agent or Firm:
Patent business corporation Shin-Osaka international patent firm