Title:
外装部材、外装部材の製造方法、及び電子機器筐体
Document Type and Number:
Japanese Patent JP5608994
Kind Code:
B2
Abstract:
There is provided an exterior member including a first layer formed on a surface of a substrate and containing coating inclusions and a second layer stacked on a surface of the first layer and containing a material that can allow light to be transmitted therethrough, the light having a wavelength at which optical characteristics of the coating inclusions can be changed. The first layer has a marking portion which is a portion where the optical characteristics of the coating inclusions have changed by laser-irradiation of the light having the wavelength to at least a part of the first layer.
More Like This:
| JPH088379 | [Title of Invention] CO Bottom 2 Laser device |
| JPS61103687 | PRODUCTION OF CONNECTING ROD |
| JP5601778 | Method for producing semiconductor wafer |
Inventors:
福馬 洋平
草間 清人
草間 清人
Application Number:
JP2009066784A
Publication Date:
October 22, 2014
Filing Date:
March 18, 2009
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B23K26/00; B32B7/02; B32B27/16; B41M5/28; B41M5/30; B41M5/34; B41M5/40; B41M5/46
Attorney, Agent or Firm:
Yoshiaki Kameya
Tetsuo Kanamoto
Yasushi Hagiwara
Matsumoto Single horseman
Tetsuo Kanamoto
Yasushi Hagiwara
Matsumoto Single horseman