Title:
半導体装置及び電源回路
Document Type and Number:
Japanese Patent JP5614286
Kind Code:
B2
Abstract:
A semiconductor apparatus comprising an integrated semiconductor circuit device having pluralities of electrode pads, pluralities of first external terminals connected to the electrode pads of the integrated semiconductor circuit device, an inductor disposed in a region surrounded by the first external terminals, and a resin portion sealing them, the integrated semiconductor circuit device being arranged on an upper surface of the inductor, and the inductor being exposed from a lower surface of the resin portion together with the first external terminals.
Inventors:
梅野 徹
Application Number:
JP2010548552A
Publication Date:
October 29, 2014
Filing Date:
January 28, 2010
Export Citation:
Assignee:
日立金属株式会社
International Classes:
H01L25/00; H01L23/28
Domestic Patent References:
| JP2007250924A | 2007-09-27 | |||
| JP2003303919A | 2003-10-24 | |||
| JP2007173712A | 2007-07-05 | |||
| JP2001077277A | 2001-03-23 |
Attorney, Agent or Firm:
Kitsuma Takaishi