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Patent Searching and Data


Title:
半田回収装置
Document Type and Number:
Japanese Patent JP5637349
Kind Code:
B2
Abstract:

To provide an apparatus for recovering solder which can recover usable molten solder by removing dross from molten solder containing the dross while restraining the diffusion of the dross dust into the air.

The apparatus for recovering solder includes; a molten solder accommodating part 10 which is formed so as to accommodate the molten solder 2 containing the dross 3 and has a communicating hole 12 formed on the side surface or the peripheral surface of the accommodating part above the position of the liquid surface 2a of the accommodated molten solder 2; a water tank 40 for accommodating liquid 41; a flowing path 50 which is provided in such a way that one end is connected with the communicating hole 12 of the molten solder accommodating part 10 and the other end is located in the liquid in the water tank 40, the flowing path 50 thereby communicating the molten solder accommodating part 10 with the water tank 40; a negative pressure generating means 60 which generates the negative pressure in the water tank 40 so as to suck the gas above the molten solder 2 accommodated in the molten solder accommodating part 10 into the water tank 40 through the flowing path 50; and a cooling means 70 for cooling gas flowing in the flowing path 50.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
甲斐谷 弘
Application Number:
JP2009219508A
Publication Date:
December 10, 2014
Filing Date:
September 24, 2009
Export Citation:
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Assignee:
甲斐谷 弘
International Classes:
C22B7/00; B01D47/02
Attorney, Agent or Firm:
Toshio Migita
1000 且 Kazuya
Sato 雄哉