Title:
ポジ型レジスト組成物及びレジストパターン形成方法
Document Type and Number:
Japanese Patent JP5663153
Kind Code:
B2
Abstract:
The present invention provides a positive resist composition capable of forming a resist pattern with high resolution, and a method of forming a resist pattern. This composition is a positive resist composition including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of acid, and an acid-generator component (B) which generates acid upon irradiation, the resin component (A) containing a polymer including: a core portion represented by general formula (1) [Chemical Formula 1] PX-Y)a (1) wherein P represents an a-valent organic group; a represents an integer of 2 to 20; Y represents an arylene group or an alkylene group of 1 to 12 carbon atoms; and X represents a specific linking group which can be cleaved under action of acid, and arm portions that are bonded to the core portion and are also composed of a polymer chain obtained by an anionic polymerization method.
Inventors:
三村 岳由
岩下 淳
岩下 淳
Application Number:
JP2009185819A
Publication Date:
February 04, 2015
Filing Date:
August 10, 2009
Export Citation:
Assignee:
東京応化工業株式会社
International Classes:
G03F7/039; G03F7/004
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Mitsuyoshi Suzuki
Igarashi Mitsunaga
Masatake Shiga
Mitsuyoshi Suzuki
Igarashi Mitsunaga