Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP5664148
Kind Code:
B2
Inventors:
堂岡 稔
Application Number:
JP2010252632A
Publication Date:
February 04, 2015
Filing Date:
November 11, 2010
Export Citation:
Assignee:
株式会社村田製作所
International Classes:
H01G4/30; B28D1/24; B28D5/00; H01G4/12; H01G13/00
Attorney, Agent or Firm:
Hitoshi Nishizawa