Title:
半導体装置
Document Type and Number:
Japanese Patent JP5672856
Kind Code:
B2
Inventors:
江口 浩次
Application Number:
JP2010188570A
Publication Date:
February 18, 2015
Filing Date:
August 25, 2010
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L29/06; H01L21/329; H01L21/8234; H01L27/04; H01L27/06; H01L27/088; H01L29/739; H01L29/78; H01L29/866
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm