Title:
複合配線基板の製造方法
Document Type and Number:
Japanese Patent JP5686653
Kind Code:
B2
Inventors:
櫻井 敬三
Application Number:
JP2011078693A
Publication Date:
March 18, 2015
Filing Date:
March 31, 2011
Export Citation:
Assignee:
京セラサーキットソリューションズ株式会社
International Classes:
H05K3/36; H05K1/14