Title:
電子部品実装装置
Document Type and Number:
Japanese Patent JP5702157
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the damage of electronic components and substrates.SOLUTION: An electronic component mounting apparatus comprises: a body part 60 fixed to a head 106; a lifting body 14 moving up and down in the body part; a lifting mechanism 20 moving up and down the lifting body; a hollow nozzle shaft 30 holding a suction nozzle at a lower end part; a rotation mechanism 50 rotating the nozzle shaft through a spline nut 55; a load detection part 40 detecting an upward load that the suction nozzle receives; and an operation control part 70 performing load control based on the load detection. The lifting mechanism and the rotation mechanism are supported by the body part, and an upper end part of the nozzle shaft is protruded from an upper part of the body part. Further, the load detection part is supported by the lifting body or the body part.
Inventors:
Masaru Saito
Yu Kawakubo
Yu Kawakubo
Application Number:
JP2011002663A
Publication Date:
April 15, 2015
Filing Date:
January 11, 2011
Export Citation:
Assignee:
JUKI Corporation
International Classes:
H05K13/04
Domestic Patent References:
| JP2001203497A | ||||
| JP2009212138A | ||||
| JP2004342662A | ||||
| JP2005327773A | ||||
| JP2002043797A | ||||
| JP8045993A | ||||
| JP8330790A | ||||
| JP2004079890A |
Foreign References:
| US20050241143 |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune