ウエハをボンディングするための処理及び装置

Title:

ウエハをボンディングするための処理及び装置

Document Type and Number:

Japanese Patent JP5704783

Kind Code:

B2

Abstract:

The invention relates to a process and a device for bonding at least two substrates (1, 2), in particular semiconductor substrates or wafers, having the following features: a) a lower pressure plate (5) for holding the substrates (1, 2) and transferring pressure and, in particular, heat to the substrates (1, 2), b) an upper pressure plate (6) located opposite the lower pressure plate (5) for transferring pressure and, in particular, heat to the substrates (1, 2), c) heating means (7, 8) for heating up the substrates (1, 2), in particular to temperatures above 250° C., and d) pressure charging means, in particular an actuator (9), for charging the lower (5) and/or upper pressure plate (6) with a pressing force F, in particular higher than 500 N, preferably higher than 1,000 N. According to the invention, the upper pressure plate (6) and/or the lower pressure plate (5) are substantially free from the chemical elements Ti and Mo at least on one substrate contact surface (5o, 6o) facing the substrates.

Inventors:

Erich Tarner

Application Number:

JP2007319924A

Publication Date:

April 22, 2015

Filing Date:

December 11, 2007

Export Citation:

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