Title:
レジスト組成物、並びに、それを用いたレジスト膜及びパターン形成方法
Document Type and Number:
Japanese Patent JP5712099
Kind Code:
B2
Abstract:
Provided is a resist composition, including (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, the compound being any of those of general formulae (I) and (II) below, (C) a resin containing at least either a fluorine atom or a silicon atom, and (D) a mixed solvent containing a first solvent and a second solvent, at least either the first solvent or the second solvent exhibiting a normal boiling point of 200°C or higher.
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Inventors:
Kei Yamamoto
Yusuke Iizuka
Akinori Shibuya
Shuhei Yamaguchi
Yusuke Iizuka
Akinori Shibuya
Shuhei Yamaguchi
Application Number:
JP2011210645A
Publication Date:
May 07, 2015
Filing Date:
September 27, 2011
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/004; C07C309/17; C07C381/12; G03F7/039; G03F7/075; H01L21/027
Domestic Patent References:
| JP2007304545A | ||||
| JP2010116352A | ||||
| JP2002214774A | ||||
| JP2010197849A | ||||
| JP2007163606A | ||||
| JP2007182488A | ||||
| JP2010102329A | ||||
| JP2008111103A |
Foreign References:
| WO2009142181A1 |
Attorney, Agent or Firm:
Kurata Masatoshi
Takakura Shigeo
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takakura Shigeo
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori