Title:
電子機器用筐体及び電子機器
Document Type and Number:
Japanese Patent JP5715095
Kind Code:
B2
Abstract:
In a cabinet for electronic apparatus, when Mg-Li alloy is employed to reduce weight of the cabinet and depressions are molded on a surface of the cabinet through presswork by using the Mg-Li alloy, neither a rough surface nor a crack appears in any bent portion forming the depressions of the cabinet. In a cabinet for electronic apparatus including a bump shape including at least one surface formed by conducting presswork for magnesium-lithium alloy, the bump shape is a shape in which a new surface formed when a reference surface before the presswork of the magnesium-lithium alloy is pushed toward the inside of the cabinet by the presswork and is placed apart from the reference surface is surrounded by the reference surface, the surface has a plate thickness t (mm) in a range of 0.4@t@2.0, and at least one bent portion constituting the bump shape has a radius of curvature R (mm) in a range of t@R.
Inventors:
Tsunetori Yanagisawa
Application Number:
JP2012150948A
Publication Date:
May 07, 2015
Filing Date:
July 04, 2012
Export Citation:
Assignee:
NEC Personal Computer Co., Ltd.
International Classes:
H05K5/02; B21D22/20; B21D22/26
Domestic Patent References:
| JP2003226929A | ||||
| JP2002124781A | ||||
| JP2001257480A | ||||
| JP2000119787A |
Attorney, Agent or Firm:
Takao Maruyama
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