Title:
フリット密封システム及び方法
Document Type and Number:
Japanese Patent JP5721248
Kind Code:
B2
Abstract:
A frit sealing system for combining a first substrate (101) and a second substrate (102) using frit (103) comprises a laser (123) generating a laser beam, and a homogenizer (127) normalizing the intensity of the laser beam within a cross section of the laser beam in the transverse direction. The frit sealing system further comprises a support apparatus (118) configured to hold a first and a second substrate with frit interposed between them, wherein the frit is configured to be cured by heat generated from the laser beam and thereby solidifying and binding the first and the second substrates.
Inventors:
Lee
Polite star
Lee Tadahiro
Kure Jun
Yukichi Yanagi
Cui Yuan
Polite star
Lee Tadahiro
Kure Jun
Yukichi Yanagi
Cui Yuan
Application Number:
JP2009042346A
Publication Date:
May 20, 2015
Filing Date:
February 25, 2009
Export Citation:
Assignee:
Samsung Display Co.,Ltd.
International Classes:
B23K26/00; B23K26/064; G09F9/00; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| JP200319588A | ||||
| JP1074583A | ||||
| JP2003123966A | ||||
| JP2007260694A | ||||
| JP2007237200A | ||||
| JP2002328288A | ||||
| JP11500541A | ||||
| JP1123878A | ||||
| JP200675854A | ||||
| JP200533007A |
Attorney, Agent or Firm:
Nobuyuki Matsunaga
Tetsuji Tsuji
Tetsuji Tsuji