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Title:
基板の緩衝層用イットリア溶液の製造方法
Document Type and Number:
Japanese Patent JP5728528
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a production method of a yttria solution for a buffer layer of a substrate, which is applied to an upper face of a substrate so as to flatten the substrate and simultaneously to serve as the buffer layer.SOLUTION: A production method of a yttria solution for a buffer layer of a substrate includes: a first step of mixing yttrium acetate tetrahydrate with methanol so as to form a mixture, and stirring the mixture; a second step of charging diethanolamine to the mixture of the first step as a chelating agent and synthesizing a synthetic product by stirring; and a third step of filtering the synthetic product synthesized in the second step by using a filter so as to obtain a sol. Thereby the yttria solution made via a sol-gel process is produced. The yttria solution is applied to an upper face of a substrate so as to flatten the substrate, and has an advantage of simultaneously serving as the buffer layer as a diffusion barrier to prevent diffusion of a substrate material.

Inventors:
Ko, rock kill
Ha, Dong Woo
Song, Myung Hwan
Kim, Dong Hyuk
Kang, Bomin
Application Number:
JP2013122568A
Publication Date:
June 03, 2015
Filing Date:
June 11, 2013
Export Citation:
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Assignee:
Korea Electrotechnology Research Institute
International Classes:
C01F17/00; H05K3/44
Domestic Patent References:
JP2007290959A
JP5155616A
JP2011246331A
JP2003286029A
JP2008044833A
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito