Title:
配線板用絶縁樹脂材料、多層配線板及び多層配線板の製造方法
Document Type and Number:
Japanese Patent JP5728998
Kind Code:
B2
Inventors:
Nobuyuki Ogawa
Matsuura Masaharu
Murai Yo
Hiroyuki Fukai
Hiroaki Fujita
Matsuura Masaharu
Murai Yo
Hiroyuki Fukai
Hiroaki Fujita
Application Number:
JP2011031131A
Publication Date:
June 03, 2015
Filing Date:
February 16, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
B32B27/38; B32B15/092; H05K3/46
Domestic Patent References:
| JP5140352A | ||||
| JP2010135477A | ||||
| JP2010260971A | ||||
| JP2009012366A | ||||
| JP8253559A |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa