Title:
銅基ろう材
Document Type and Number:
Japanese Patent JP5729276
Kind Code:
B2
Abstract:
A copper brazing filler metal includes Ni in an amount of from 20 or more to 36% or less by mass, Mn in an amount from 19 or more to 30% or less by mass, Fe in an amount of from 0 or more to 16% or less by mass, Si in an amount of from more than 0 (not inclusive) to 2% or less by mass, B in an amount of from 0.1 or more to 0.5% or less by mass, and the balance being copper (Cu) as well as inevitable impurities and/or a modifying element, when the entirety is taken as 100% by mass. Moreover, the copper brazing filler metal exhibits a ratio of the Ni content with respect to the Mn content (i.e., (Ni Content)/(Mn Content)) that falls in a range of from 1.1 or more to 2 or less when being free from Fe.
Inventors:
Kazuhiko Ito
Tadashi Oshima
Takashi Takashi
Tadashi Oshima
Takashi Takashi
Application Number:
JP2011261568A
Publication Date:
June 03, 2015
Filing Date:
November 30, 2011
Export Citation:
Assignee:
Toyota Central R & D Labs.
International Classes:
B23K35/30; B22F7/06; B23K1/19; B23K35/40; C22C9/05; C22C9/06
Domestic Patent References:
| JP2015875A |
Attorney, Agent or Firm:
Hiroshi Okawa