Title:
太陽電池モジュール構造体
Document Type and Number:
Japanese Patent JP5739037
Kind Code:
B2
Abstract:
A method for assembling a solar module structure comprises patterning a frontside and a backside of a double-sided printed circuit board coated with metallic foils according to desired frontside and backside interconnect layouts; applying a first coating layer to the rear side of a plurality of three-dimensional thin-film solar cells, each three-dimensional thin-film solar cell comprising: a three-dimensional thin-film solar cell substrate comprising emitter junction regions and doped base regions; emitter metallization and base metallization regions; the three-dimensional thin-film solar cell substrate comprising a plurality of single-aperture unit cells; placing the three-dimensional thin-film solar cells on the frontside of the double-sided printed circuit board; preparing a solar module assembly, comprising: a glass layer; a top encapsulant layer; the plurality of three-dimensional thin-film solar cells on the frontside of the double-sided printed circuit board; a rear encapsulant layer; a protective back plate; and sealing and packaging the solar module assembly.
Inventors:
Mosley Meherdard
Application Number:
JP2014076786A
Publication Date:
June 24, 2015
Filing Date:
April 03, 2014
Export Citation:
Assignee:
Solexel, Inc.
International Classes:
H01L31/05; H01L31/0236; H01L31/047; H01L31/056; H01L31/068
Domestic Patent References:
| JP4015962A | ||||
| JP11330517A | ||||
| JP2006237543A | ||||
| JP2004172603A |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Naoki Kondo
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Naoki Kondo