Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5745962
Kind Code:
B2
Inventors:
Masao Kikuchi
Yuji Imoto
Naoki Yoshimatsu
Osamu Usui
Yuji Imoto
Naoki Yoshimatsu
Osamu Usui
Application Number:
JP2011158683A
Publication Date:
July 08, 2015
Filing Date:
July 20, 2011
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| JP2011109127A | ||||
| JP2005228877A | ||||
| JP2006294921A | ||||
| JP9145900A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita