Title:
半導体装置、その実装構造及びその製造方法
Document Type and Number:
Japanese Patent JP5752964
Kind Code:
B2
More Like This:
Inventors:
Tomoyuki Kosugi
Application Number:
JP2011064147A
Publication Date:
July 22, 2015
Filing Date:
March 23, 2011
Export Citation:
Assignee:
Tera Probe Co., Ltd.
International Classes:
H01L23/12
Domestic Patent References:
| JP2000216179A | ||||
| JP2002280485A | ||||
| JP11135673A | ||||
| JP2005347362A | ||||
| JP2002290031A | ||||
| JP200337210A |
Attorney, Agent or Firm:
Hidemi Kashima