Title:
流量センサおよびその製造方法
Document Type and Number:
Japanese Patent JP5763575
Kind Code:
B2
Abstract:
Provided is a technology capable of improving performance by minimizing performance inconsistency of each flow sensor (this also includes enhancing reliability to improve performance). For example, when a lead frame (LF) on which a semiconductor chip (CHP1) is mounted is sandwiched between an upper mold (UM) and a bottom mold (BM), a frame body (FB) and an elastic film (LAF) are interposed between the lead frame (LF) on which the semiconductor chip (CHP1) is mounted and the upper mold (UM). At this point, the height of the frame body (FB) is higher than the height of a flow detector (FDU) and the elastic modulus of the frame body (FB) is smaller than the elastic modulus of the semiconductor chip (CHP1).
Inventors:
Tsutomu Kono
Keiji Hanzawa
Noboru Tokuyasu
Shinobu Tashiro
Keiji Hanzawa
Noboru Tokuyasu
Shinobu Tashiro
Application Number:
JP2012062577A
Publication Date:
August 12, 2015
Filing Date:
March 19, 2012
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
G01F1/684
Domestic Patent References:
| JP2011122984A | ||||
| JP200958230A | ||||
| JP2003161721A | ||||
| JP469958A |
Attorney, Agent or Firm:
Yamato Tsutsui