Title:
ダイシングテープ及び半導体ウエハ加工方法
Document Type and Number:
Japanese Patent JP5764519
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dicing tape and a semiconductor wafer processing method using the dicing tape, which can efficiently pick up a thin semiconductor chip and reduce adhesion of contaminant to a surface of the picked up semiconductor chip to a significant degree in a pick up process after a dicing process.SOLUTION: A dicing tape includes a radiation curable adhesive layer formed on at least one surface of a base resin film. The adhesive layer is formed such that acryl polymer (A) in which a hydroxyl group is joined to a main chain, and polyether polyol (B) having more than two hydroxyl groups in a molecule are cross-linked by using polyisocyanate as a crosslinking agent (C).
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Inventors:
Yu Tamagawa
Shozo Yano
Yuuhiro Matsubara
Hattori Satoshi
Shozo Yano
Yuuhiro Matsubara
Hattori Satoshi
Application Number:
JP2012084376A
Publication Date:
August 19, 2015
Filing Date:
April 02, 2012
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; C09J7/02; C09J11/06; C09J175/04
Domestic Patent References:
| JP2008060434A | ||||
| JP2004256793A | ||||
| JP4335078A | ||||
| JP2002241732A | ||||
| JP2010168541A |
Foreign References:
| US20080160300 |
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae
Naosuke Miyamae
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