Title:
脆性材料基板のスクライブ装置
Document Type and Number:
Japanese Patent JP5767595
Kind Code:
B2
Inventors:
Ikuyoshi Takamatsu
Yoshitaka Miura
Keisuke Tominaga
Yoshitaka Miura
Keisuke Tominaga
Application Number:
JP2012036934A
Publication Date:
August 19, 2015
Filing Date:
February 23, 2012
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/037; B28D5/00
Domestic Patent References:
| JP2003267742A | ||||
| JP2007004116A | ||||
| JP6102480A | ||||
| JP6345471A |
Foreign References:
| US4471895 |
Attorney, Agent or Firm:
Yoshio Kashima