Title:
ＭＥＭＳデバイス及びその製造方法
Document Type and Number:
Japanese Patent JP5771916
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a MEMS device which can reduce influence on a characteristic of a MEMS (Micro Electro Mechanical Systems) element with hardly being affected by external environments of moisture and temperature, etc.SOLUTION: The MEMS device includes: the substrate; the MEMS element arranged on the substrate and including a support part, a movable part displacing in relation to the support part and a lid member covering the movable part and fixed to the support part; a foam covering at least the surrounding of the MEMS element. This method is provided to manufacture the MEMS device in which the MEMS element including the support part, and the movable part displacing in relation to the support part and the lid member covering the movable part and fixed to the support part is arranged on the substrate, foamed resin is dropped on the MEMS element and foamed resin is foamed.
Inventors:
Satoru Kuramochi
Application Number:
JP2010174908A
Publication Date:
September 02, 2015
Filing Date:
August 03, 2010
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B81B1/00; B81C3/00; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005129888A | ||||
| JP2010021225A | ||||
| JP59186352A | ||||
| JP2009038053A | ||||
| JP2005285864A | ||||
| JP6143884A | ||||
| JP2006153799A | ||||
| JP2004257841A | ||||
| JP2010153751A | ||||
| JP4047241A | ||||
| JP63169167A | ||||
| JP2009226571A |
Foreign References:
| US20080283988 |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners