Title:
プローブカード用セラミック基板及びその製造方法
Document Type and Number:
Japanese Patent JP5774332
Kind Code:
B2
Inventors:
Yun Suk Chur
Application Number:
JP2011050163A
Publication Date:
September 09, 2015
Filing Date:
March 08, 2011
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
G01R1/073; H05K3/46
Domestic Patent References:
| JP2009075027A | ||||
| JP2009074823A | ||||
| JP2006275714A | ||||
| JP2008164577A | ||||
| JP2012142534A |
Foreign References:
| KR1020090027353A |
Attorney, Agent or Firm:
Konobu Kato