Title:
レーザ加工方法及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5775265
Kind Code:
B2
Inventors:
Makoto Nakano
Taku Inoue
Haruyasu Ito
Naoya Matsumoto
Taku Inoue
Haruyasu Ito
Naoya Matsumoto
Application Number:
JP2010068684A
Publication Date:
September 09, 2015
Filing Date:
March 24, 2010
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
B23K26/53; B23K26/00; B23K26/064; B23K26/067; B23K26/38; B23K26/40; H01L21/301
Domestic Patent References:
| JP2006068762A | ||||
| JP2009034723A | ||||
| JP2004141929A | ||||
| JP2007125582A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Satoru Ishida
Arai Tohio
Shiro Terasaki
Satoru Ishida
Arai Tohio