Title:
新規な感光性樹脂組成物作製キット及びその利用
Document Type and Number:
Japanese Patent JP5789612
Kind Code:
B2
Abstract:
The object of the present invention is to provide a photosensitive resin composition which is excellent in: storage stability in a long-term storage; microfabricability; developability; low-temperature curability; flexibility in a cured film; electrical insulation reliability; solder heat resistance; resistance to an organic solvent; and flame retardancy and low in post-curing warpage when processed into a substrate. The object can be attained by use of a photosensitive resin composition production kit which includes at least two or more components including an A component and a B component. The A component contains a (A) compound having a carboxyl group. The B component contains a (B) compound having a reactive group which is reactive to a carboxyl group, a (C) oxime ester photopolymerization initiator, and a (D) compound having a photosensitive group but no carboxyl group.
Inventors:
Tomohiro Yoshida
Yoshihide Kanto
Tetsuya Ogiso
Yoshihide Kanto
Tetsuya Ogiso
Application Number:
JP2012536256A
Publication Date:
October 07, 2015
Filing Date:
July 01, 2011
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
G03F7/031; G03F7/004; G03F7/26
Domestic Patent References:
| JP2008299294A | 2008-12-11 | |||
| JP2007171812A | 2007-07-05 |
Foreign References:
| WO2004048434A1 | 2004-06-10 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark
Previous Patent: 嚢胞性線維症膜コンダクタンス制御因子のモジュレーターを調製するため...
Next Patent: FLAME-RETARDANT ACRYLIC SYNTHETIC FIBER
Next Patent: FLAME-RETARDANT ACRYLIC SYNTHETIC FIBER