Title:
電子部品実装装置
Document Type and Number:
Japanese Patent JP5792588
Kind Code:
B2
Abstract:
The present invention provides an electronic component mounting device which can perform nailing treatment of a lead terminal that is inserted into a mounting type electronic component without a special machine when the electronic component is carried. When the electronic component is carried, a supporting pin (40) of a supporting device is used for supporting a circuit substrate (5) from the back surface. The supporting pin (40) is provided with a nailing guiding part (41) which is configured right below an insertion hole (5a) that causes insertion of a lead (20a) of a lead component (20). The upper part of the nailing guiding part (41) is provided with a lead guiding groove (41a) which extends along a vertical direction. The bottom surface of the lead guiding groove (41a) becomes an inclined surface which inclines relative to a horizontal surface. Therefore, when the lead (20a) of the lead component (20) is inserted into the insertion hole (5a), the lead (20a) is nailed along the inclined surface.
Inventors:
Atsushi Saito
Application Number:
JP2011234213A
Publication Date:
October 14, 2015
Filing Date:
October 25, 2011
Export Citation:
Assignee:
JUKI Corporation
International Classes:
H05K13/04
Domestic Patent References:
| JP7221499A | ||||
| JP6112692A | ||||
| JP4055200U | ||||
| JP6061696A | ||||
| JP53122769A | ||||
| JP61193727A |
Foreign References:
| US3435857 | ||||
| EP0542095A1 |
Attorney, Agent or Firm:
Ichi Hirose
Toru Miyasaka
Toru Miyasaka