Title:
転写可能な半導体構造、デバイス、及びデバイスコンポーネントを作成するための剥離方法
Document Type and Number:
Japanese Patent JP5805712
Kind Code:
B2
Abstract:
Provided are methods for making a device or device component by providing a multi layer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
Inventors:
Rogers, John A.
Nuzzo, Ralph, Gee.
Mattle, matthew
Kyung, Hyun Cho
Yoon, John Seung
Menard, Etienne
Stupid, Alfred, Jay.
Nuzzo, Ralph, Gee.
Mattle, matthew
Kyung, Hyun Cho
Yoon, John Seung
Menard, Etienne
Stupid, Alfred, Jay.
Application Number:
JP2013144886A
Publication Date:
November 04, 2015
Filing Date:
July 10, 2013
Export Citation:
Assignee:
The Board of Trustees of the University of Illinois
International Classes:
H01L21/02; H01L21/20; H01L27/12; H01L31/056; H01L31/0693; H01L33/02
Domestic Patent References:
| JP2005311333A |
Foreign References:
| US20060115917 | ||||
| US20070173034 | ||||
| WO2007083570A1 | ||||
| US20100224915 |
Attorney, Agent or Firm:
Yuichi Yamada
Masakazu Noda
Ikeda adult
Masakazu Noda
Ikeda adult