Title:
半導体モジュール及びスペーサ
Document Type and Number:
Japanese Patent JP5807432
Kind Code:
B2
Inventors:
Tetsuya Nishiguchi
Shinichi Yamada
Yoshiki Morikawa
Toshinori Miura
Goji Noyose
Shinichi Yamada
Yoshiki Morikawa
Toshinori Miura
Goji Noyose
Application Number:
JP2011169775A
Publication Date:
November 10, 2015
Filing Date:
August 03, 2011
Export Citation:
Assignee:
KABUSHIKI KAISHA MEIDENSHA
International Classes:
H01L23/48
Domestic Patent References:
| JP2004303900A | ||||
| JP2007165588A | ||||
| JP2007311441A | ||||
| JP2007281443A |
Attorney, Agent or Firm:
Hiromichi Kobayashi
Uzawa Hidehisa
Tsuyoshi Hashimoto
Uzawa Hidehisa
Tsuyoshi Hashimoto